PCB mounting
Providing services from development and prototyping to mass production
JOHNAN offers consistent services and assistance from product development and prototyping to mass production. Providing various proposals to solve challenges relating to PCB mounting, we support high-quality manufacturing. We also flexibly respond to changes in mass production systems due to sudden fluctuations in production.
1. Features and strengths
from product development
and prototyping to mass production
2. Products and service
We meet a wide range of needs relating to the manufacturing of electronic components and equipment or PCB mounting, from development and prototyping to mass production.
Applicable board
Ceramic PCB, aluminum PCB , Flexible pattern circuit, multi-layered PCB, L size PCB , paper phenol PCB, etc.
Type of solder
Pb-free solder (with Ag) Pb-free solder (without Ag)
Applicable board
SMT mounting (surface mounting technology)
[accuracy]chip0402, lead spacing: 0.3mm, adjoining pitch: 0.1mm.
[IC package types] BGA, SOP, QFP, LED, QFN, etc.
[Corresponding size] Maximum size: 360mm×410mm Plate thickness: 0.5mm~1.6mm (MAX:5.0mm).
Chip-on-Board mounting
[Mountable chip thickness]0.2 mm to 10 mm
[Wire] Gold wire (20 to 38μ), Aluminum wire (100 to 400μ)
Capability for chip mounting/discrete mounting
- chip0402
- chip0603
- We have experience of mounting 0603 chips using bonding adhesives and flow soldering.
- 3D mounting
Services
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Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Please feel free to contact us